HID Global, a provider in solutions for secure identity, surpassed its 100 millionth product shipment of e-government inlays and prelaminates to 28 countries worldwide this month. With the broadest portfolio of e-doc, e-passport and e-national ID solutions in the market, HID is an innovator and developer in the deployment of two of the most wide-spread technologies for extended durability of contactless e-documents, wire transfer and wire embedding technologies. Additionally, the company developed and patented a thin, flexible high-tech inlay material that increases e-document resiliency.
“This milestone proves that our e-government solutions have achieved unprecedented customer acceptance. Countries worldwide continue to look to HID for e-doc, e-passport and e-national ID solutions, said Mark Scaparro, Senior VP of Identification Solutions (IDS) at HID Global. “With over 15 years of unique expertise around RFID through our Genuine HID inlays, prelaminates, readers and printers/encoders, as well as our proven wire embedding and wire transfer innovations, HID Global is well poised to meet the rapidly escalating demands for e-government solutions worldwide.”
Acuity Market Intelligence has projected that e-passport market revenues will reach nearly US$7 billion annually by the end of 2014, with a compounded annual growth rate of 31.5 percent. In its April study entitled “The Global e-Passport and e-Visa Industry Report,” the firm said that 88 percent of all passports issued in 2014 will be electronic passports. Acuity said e-passports accounted for 57 percent of all passports issued and 28 percent of all passports in circulation during 2009.
“The recent expansion of HID Global's e-government campus in Connemara, Galway, Ireland, enables us to meet the growing demand for product and service solutions for government agencies worldwide,” said Jason Bohrer, Senior VP, HID Global Operations. “Our expanded e-government operations give us significantly higher production capacity for our microchip-based inlays, which are used as core components in the manufacture of e-documents, e-passports and e-national IDs.”