Gemtek Technology and AcSiP Technology have teamed up to unveil the world’s smallest LoRa+MCU module using System in Package (SiP) techniques, reports said this week.
Gemtek Technology and AcSiP Technology have teamed up to unveil the world’s smallest LoRa+MCU module using System in Package (SiP) techniques, reports said this week.
SiP pertains to the number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, and so on.
The latest LoRa+MCU module is a step up from its previous version – dropping from the original 18 by 18 millimeters to the current 13 by 11 millimeters. According to AcSiP, the size downgrade will provide engineers with more flexibility when mapping out their printed circuit designs.
The upgraded LoRa+MCU SiP module is expected to draw up considerable demand on the market thanks to its latest design architecture.
The other positive feat about this new breakthrough is that it will help manufacturers to greatly reduce production costs and time-to-market, reports said.
An example SiP can contain several chips—such as a specialized processor, DRAM, flash memory—combined with passive components—resistors and capacitors—all mounted on the same substrate. This means that a complete functional unit can be built in a multi-chip package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like MP3 players and mobile phones as it reduces the complexity of the printed circuit board and overall design.
According to the two companies, the LoRa+MCU SiP is expected to be adopted in a wide range of end devices and application sectors, from wearables and tracking devices to surveillance and home automation.