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Product Info
T-GLOBAL TECHNOLOGY TGX Ultra Soft Thermal Pad

T-GLOBAL TECHNOLOGY TGX Ultra Soft Thermal Pad

T-GLOBAL TECHNOLOGY
Region: Taiwan
Update: 11/16/2015
Key Specifications

Low molecular chemical base material with low oil-bleed

No effect on the appearance and function of the applications 

Ultra soft and high compressibility; as a buffer in electronics

Electrical insulation   

https://www.asmag.com/project/dahua_xinghan_large-scale_ai_models/