* Ticket options: single, fan-fold (Leporello), on roll
* Disposable one-way and durable multi-use tickets
* Blank, printed (single side, double sided)
* Design flexibility
* HF 13.56 MHz Identive Smart Inlays
* Supported standards: ISO15693, ISO14443A/B, PJM–ISO/IEC 18000-3 Mode 2
* Etched Cu or Al inlays with direct chip bonding to avoid module bumps on ticket surface
* Materials: paper, thermal direct paper, PET, others on request
* RFID chips from NXP, Infineon, STM, EM, Inside, Sony, others on request
* Coding and personalization service