Headpcb
Product Info
HIGH HEAT DISSIPATION MCPCB
Headpcb
Region: China
Update: 2019/05/23
INQUIRY
Key Specifications
Project Description
| Parameters
1 Layer
Thickness: 1.2+/-0.1 mm
Min Hole Size: 3.175 mm
Width/Space: 0.12mm/0.1 mm
Surface Treatment: OSP
| Craft
White Ink
3W Heat Dissipation Coefficient
| Application
LED Light