Headpcb
Headpcb

Products

Company Info

News
Product Info
HIGH HEAT DISSIPATION MCPCB
HIGH HEAT DISSIPATION MCPCB
Headpcb
Region: China
Update: 2019/05/23
INQUIRY
Key Specifications
Project Description

| Parameters

1 Layer

Thickness: 1.2+/-0.1 mm

Min Hole Size: 3.175 mm

Width/Space: 0.12mm/0.1 mm

Surface Treatment: OSP

| Craft

White Ink

3W Heat Dissipation Coefficient

| Application

LED Light

https://www.supremainc.com/en/hardware/ai-powered-biometric-terminal-biostation-3-max.asp?utm_source=asmag&utm_medium=banner_ad&utm_campaign=bs3-max-launch