Contactless IC packaging (330um) service is specific for RFID and Smart Card IC to modules (COB) for final product like priximity card, transpotation tickit and payment solution. 330um is super-thin technology for more thinner product design. We made millions contactless modules with IC of NXP, STM, Infineon and famious brand in the word with high yield rate quality.

1.1 .Lead frame

Base material

CuSn6

Plating

Flash plating

1.5+/-0.5um

Spot plating

4+/-1um

Total thickness

64 +8/-5um

1.2 Chip adhesive

Material

Epoxy Resin

Type

Non-conductive type

1.3 Bond wire

Material

Au wire (99.99%)

Type

Ø 1.0mil

1.4 Encapsulation

Material

Epoxy molding compound

Type

Molding

Color

Black

Solidification

Total hardened

Product Details:

Body Size:

4.9 x 5.1 mm

Module Size:

5.0 x 8.0 mm

Module Thickness

0.33mm

Payment Terms:

Minimum Order Quantity:

100K pcs

Port:

Taiwan Kaohsiung

Payment Terms:

L/C,T/T

TAG: #MOA4, #CB4, #Ultra-thin contactless module