Join or Sign in

Register for your free asmag.com membership or if you are already a member,
sign in using your preferred method below.

To check your latest product inquiries, manage newsletter preference, update personal / company profile, or download member-exclusive reports, log in to your account now!
Login asmag.comMember Registration
https://www.asmag.com/project/resource/index.aspx?aid=17&t=isc-west-2024-news-and-product-updates
INSIGHTS

Global recognition for DEEPX's DX-M1 Chip as the premier AI NVR solution

Global recognition for DEEPX's DX-M1 Chip as the premier AI NVR solution
In the rapidly evolving physical security landscape, the integration of AI technology has become a crucial factor. This is particularly true when it comes to implementing AI functionalities such as object detection and intelligent video analysis directly at the semiconductor level. Amid this technological revolution, DEEPX's DX-M1 chip stands out as a pioneering solution.
In the rapidly evolving physical security landscape, the integration of AI technology has become a crucial factor. This is particularly true when it comes to implementing AI functionalities such as object detection and intelligent video analysis directly at the semiconductor level. Amid this technological revolution, DEEPX's DX-M1 chip stands out as a pioneering solution. 

Crafted using the advanced 5nm manufacturing process, it is currently the only chip in the market offering an unparalleled combination of power efficiency and performance. Its capabilities include supporting real-time AI computational processing at a rate exceeding 30 frames per second for up to 16 channels of multichannel video data, all on a single chip. Additionally, the DX-M1 can simultaneously process various AI algorithms, including object recognition and image classification, supporting a broad array of AI models ranging from the widely used YOLOv5 to the newest YOLOv8 and vision transformer models.

Revolutionizing AI acceleration: A symphony of efficiency, performance, and affordability

The DX-M1 chip is at the forefront, thanks to its amalgamation of cutting-edge technologies, superior efficiency, and performance, all while maintaining low power consumption and cost-effectiveness. These features make it an ideal choice for consumers in search of top-tier AI chips. DEEPX has achieved this feat through innovation in two key areas:
  • IQ8: A novel INT8 model compression technology that significantly enhances performance.
  • Smart memory access: This innovation drastically reduces D-RAM usage to a fraction of what is typically consumed by GPUs, which is especially advantageous for inference tasks.
​Leveraging IQ8 technology for model compression along with smart memory optimization allows DEEPX to achieve exceptional performance even with LPDDR memory, circumventing the need for costly HBM solutions. Consequently, DEEPX offers capabilities that exceed GPU performance-per-watt by over tenfold.

Unlike its competitors that require between 32MB to 50MB of cache memory, the DX-M1 uses substantially less, thereby combining the efficiency of AI computational processing, accuracy, and the ability to support a diverse range of AI algorithms. Furthermore, the DX-M1 is available in a compact M.2 module for easy integration into existing systems, enabling a seamless transition to low-power, high-performance AI solutions.

Discover the transformative impact of the DX-M1 by visiting DEEPX at Booth #31107 at the Venetian Expo Center during ISC West 2024, from April 9-12 in Las Vegas, NV, and at Booth #123, Nangang Hall during Secutech Taipei 2024, from April 24-26 in Taipei, Taiwan.

Empowering edge AI: The dawn of on-device AI solutions

DEEPX is also spearheading the Early Engagement Customer Program (EECP) to provide early access to its innovative solutions, including the DX-V1 for smaller camera modules, the DX-M1 for M.2 modules, and the DXNN, a bespoke developer environment. This program represents a collaboration with leading industry partners, aiming to facilitate the widespread adoption of on-device AI. With more than 90 global customers such as Samsung, SKT, KT, LG, Fullhan, Molchip currently exploring the integration of these solutions into their products, DEEPX is set to commence mass production later this year, ensuring full integration into customer products by 2025.
 

DEEPX has distinguished itself as the first AI chip company to achieve the 2024 CES Innovation Awards across three categories: Computer Hardware, Embedded Technology, and Robotics. With over 220 patents pending in the U.S., China, and Korea, DEEPX is not only leading the charge in edge AI chip technology but also expanding its global footprint, with a particular focus on the United States, Europe, China, and Taiwan. This commitment to innovation and global expansion underscores DEEPX's position as a trailblazer in the AI semiconductor industry.


Product Adopted:
Other
Subscribe to Newsletter
Stay updated with the latest trends and technologies in physical security

Share to: