Reinforcing its commitment to innovations in the high-performance embedded processing space, Texas Instrumen unveiled its newest digital signal processors (DSPs), the TMS320C66x generation of devices, including four new scalable C66x processors, delivering the industry's highest performing multicore DSPs. Ideal for applications that demand high-performance and low power, these new C66x DSPs are built with multiple 1.25 GHz DSP cores and deliver the industry's first 10-GHz DSP with 320 GMACs and 160 GFLOPs of combined fixed- and floating-point performance on a single device. TI's new C66x DSP core surpasses the performance of any other DSP in the industry, as seen in the independent BDTI benchmarks, and is the first DSP to achieve the highest scores on both fixed- and floating-point performance.
Reinforcing its commitment to innovations in the high-performance embedded processing space, Texas Instrumen unveiled its newest digital signal processors (DSPs), the TMS320C66x generation of devices, including four new scalable C66x processors, delivering the industry's highest performing multicore DSPs. Ideal for applications that demand high-performance and low power, these new C66x DSPs are built with multiple 1.25 GHz DSP cores and deliver the industry's first 10-GHz DSP with 320 GMACs and 160 GFLOPs of combined fixed- and floating-point performance on a single device. TI's new C66x DSP core surpasses the performance of any other DSP in the industry, as seen in the independent BDTI benchmarks, and is the first DSP to achieve the highest scores on both fixed- and floating-point performance.
Using TI's C66x multicore DSPs, infrastructure developers can now more easily design integrated, software upgradeable, power and cost-efficient platforms in markets such as mission critical, including public safety and defense, medical and high-end imaging, test and automation, high-performance computing and core networking. The C66x DSPs are based on TI's KeyStone multicore architecture, designed to maximize the throughput of on-chip data flows and eliminate the possibility of bottlenecks, so that developers can fully utilize the vast processing power of the DSP cores. The C66x DSPs include three pin-compatible multicore DSPs in two, four and eight core versions, the TMS320C6672, TMS320C6674 and TMS320C6678 respectively, as well as a four-core communications System-on-Chip (SoC), the TMS320C6670.
With TI's free multicore software developer's kit (MC-SDK) and comprehensive suite of multicore tools, as well as a rich ecosystem of software and hardware partners, the power of TI's KeyStone multicore silicon architecture is open to customers, empowering them to develop innovative products for advanced infrastructure applications. The new C66x multicore DSPs are also software compatible with TI's existing TMS320C6000 DSPs, enabling vendors to reuse their existing software and preserve their investment in TI embedded processors.
For manufacturers, no other devices in the market, including FPGAs, GPUs or other DSPs, can support all of the key features needed for the development of compute-intensive products in one device:
● Industry's highest performance (in terms of total GHz, GMACs, GFLOPs)
● Integration of floating point capabilities
● Real-time signal processing
● Low power
● Simplified multicore development
“Our new power-efficient C66x multicore devices are an aggressive game changer, providing developers with a cost effective solution and unprecedented levels of performance to match the needs of the industry and our customers,” said Brian Glinsman, GM of TI's communications infrastructure business. “At the same time, our easy to program KeyStone multicore architecture, code compatible C66x DSP core and software development kit allows developers to shorten their development time and design future-proof, software upgradeable products.”